i.MX 94 OSM Size-L
System on Module
iG-G85M®
- i.MX 94 SoC with 4 x Cortex-A55@1.7GHz, 1 x M33 core@300MHz, 1 x M33 core@333MHz and 2 x M7 core@800MHz
- 4GB LPDDR5
- 16GB eMMC
- Supports 2 x 1Gb Ethernet
- OSM v1.2 Size-L LGA Solderable Module
Documents
| Features | Details |
|---|---|
| CPU | 4 x Cortex-A55@1.7GHz, 1 x M33 core@300MHz, 1 x M33 core@333MHz and 2 x M7 core@800MHz |
| Memory & Storage | 4GB LPDDR5 16GB eMMC 32Kb EPPROM |
| OSM LGA Features | 5 x RGMII 1 x USB 2.0 1 x USB 3.0 1 x SD (4bit) 2 x SPI 4 x I2C 2 x UART with Flow Control 1 x I2S 2 x UART w/o Flow Control 1 x Debug UART 2 x CAN 2 x PCIe 3.0 1 x LVDS DSI(4 lane) 5 x PWM 1 x JTAG 6 x ADC(ADC x 4 supported through vendor defined pins) GPIOs |
| OS Support | Linux 6.12.49 |
| General Features | Power Input: 5V, 2.5A through OSM LGA Form Factor: 45mm x 45mm (Size L) Operating Temperature: -40°C to +85°C (Industrial Grade) Environment Specification: REACH & RoHS3 Compliant |
- 1000/100/10 Mbps Ethernet Jack x 2
- USB 2.0 OTG (microAB Receptacle Connector) x 1
- USB 3.0 x1 (Dual-stack Type-A Connector)/USB Type-C connector
- Micro SD Connector x 1
- Debug UART Header x 1
- RS232 Header x 1
- M.2 Key-B Connector x 1
- Audio In & Out Jack through I2S Codec x 1
- Speaker Header
- CAN Header x 1
- SPI flash
Thermal design For any highly integrated OSM Modules, thermal design is very important factor. iWave Supports Heat Sink solution i.MX94 OSM LGA Module.
Enclosure is essential for a SBC, iWave provides rugged Aluminum and metal enclosure options which keeps the device safe whilst maintaining full access to all the major ports.
