Zynq™ UltraScale+™ ZU19/ZU17/ZU11EG oHFM System on Module

iG-G35O®

  • Zynq™ UltraScale+™ MPSoC family Compatible with ZU19/ZU17/ZU11EG devices
  • 4GB DDR4 RAM for PS with ECC & 2X 4GB DDR4 RAM for PL
  • 256Mb QSPI Flash & 128GB eMMC Flash is supported
  • 2KB FRU EEPROM
  • Up to 1143K Logic cells & 523K LUTs
  • 16 GTY Transceivers, 32 GTH Transceivers, 4 PS GTR Transceivers and 192 IOs
  • Form Factor: 75mm x 120mm (oHFM.c XL)
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Documents

Features Details
CPU ZU19/ZU17/ZU11 EG

Processing System (PS)

  • Quad/Dual Arm Cortex-A53 @1.5GHz, Dual Cortex-R5 @600MHz
  • Arm Mali-400MP2 GPU @677MHz

Programming Logic (PL)

  • Up to 1143K Logic cells & 523K LUTs
  • PL GTY High Speed Transceivers x 16 @32.75 Gbps
  • PL GTH High Speed Transceivers x 32 @16.3 Gbps
Memory 64bit, 4GB DDR4 RAM for PS with ECC
64bit, 2X 4GB DDR4 RAM for PL
Storage 256MB QSPI Flash
128GB eMMC Flash
2KB FRU EEPROM
High Density Board to Board Connectors Interfaces PL-GTY High Speed Transceivers (up to 32.75Gbps) x 16
PL-GTH High Speed Transceivers (up to 16.3Gbps) x 32
Four 320pin High Speed Board to Board Connectors Interfaces

 

 

From PS Block:

  • PS-GTR High Speed Transceivers (up to 6Gbps) x 4
  • Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY)
  • USB2.0 OTG x 1 Port (through On-SOM USB2.0 transceiver)
  • RGMII Interface x 1
  • SD (4bit) x 1
  • SPI x 1, CAN x 2, I2C x 2
  • Debug UART x 1, Data UART x 1
  • PS JTAG

From PL Block

  • PL-GTY High Speed Transceivers (up to 32.75Gbps) x 16
  • PL-GTH High Speed Transceivers (up to 16.3Gbps) x 32
  • PL IOs – 192 IOs
  • HP Bank IOs – Up to 48 LVDS IOs/96 Single ended (SE)IOs
  • HD Bank IOs – Up to 96 Single ended (SE)IOs
General Features Power Input: 12V through B2B Connector 1 & 2
Form Factor: 75mm x 120mm (oHFM.c XL)
BSP Support: Linux – BSP
Operating Temperature: -40°C to +85°C (Industrial)
Environment Specification: REACH & RoHS3 Compliant
Compliance: CE*

*Under progress

  • MCU
  • 2KB FRU EEPROM
  • 256MB QSPI
  • 128GB EMMC
  • PS DDR4 4GB with ECC
  • PL DDR4 4GB x2
  • LS_TXVR x4 (PCIEx4/USB 3.0 & 2.0/ DP Type C/ SFP28)
  • FMC+ Connector
  • PCIEx4 Gen3 Connector
  • 100G QSFP+ Connector
  • General purpose LEDs
  • DIP Switch
  • PMOD Connector
  • 40Pin Header (UART, CAN, GPIO)
  • Clock Synthesizer (SYNC_IN, SYNC_OUT)
  • Reset Switch
  • RGMII Magjack1
  • RGMII Magjack2
  • Debug UART
  • I2C x2
  • USB2.0
  • SD
  • JTAG
  • Boot Select DIP Switch
  • Operating Temperature: -40°C to +85°C
  • Form Factor: 120mm X 150mm

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